Relife RL-400 - Solder Paste 183°C (20g)
Relife RL-400 Solder Paste (20g) is a high-precision, lead-based solder with a melting point of 183°C. Featuring an Sn63/Pb37 alloy, high viscosity, and fine granule size, it ensures reliable bonds for PCB and BGA soldering with minimal residue.
Match code
RL-400
Artikel
1100294319
Relife RL-400 - Solder Paste 183°C (20g)
The Relife RL-400 Solder Paste is a medium-temperature, lead-based soldering material meticulously formulated for high-precision electronic repairs. This 20g solder paste is designed to melt at 183°C, making it ideal for tasks requiring a strong, reliable bond, such as PCB mainboard soldering and BGA welding processes.
Features
- Optimized Alloy Ratio: Composed of Sn63/Pb37, providing a perfect balance between workability and strength.
- Medium Temperature Melting Point: Melts uniformly at 183°C, suitable for sensitive electronic components.
- High Viscosity: Ranges from 160-230Pa.s, ensuring the paste stays in place before soldering.
- Fine Granule Size: With a granule size of 20-38um, it allows for precise application without clogging.
- No-Clean Formula: Leaves minimal residue, reducing the need for post-soldering cleanup.
Technical Parameters
- Brand: Relife
- Model: RL-400
- Alloy Ratio: Sn63/Pb37
- Viscosity: 160-230Pa.s
- Granule Size: 20-38um
- Melting Point: 183°C
- Net Weight: 20g
Specification
- Tool typeBatteries
- CategorySoldering Tools
- Netto weight (kg)0.000
- Ean2200000516459
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