Relife RL-401 - Solder Paste 183°C (30g)
Relife RL-401 Solder Paste (30g) is a lead-based solder with a melting point of 183°C, perfect for precise electronic repairs. Its Sn63/Pb37 alloy ensures strong bonds, while high viscosity and fine granule size offer easy application and minimal residue. Ideal for PCB and BGA soldering.
Match code
RL-401
Artikel
1100294320
Relife RL-401 - Solder Paste 183°C (30g)
The Relife RL-401 Solder Paste is a medium-temperature, lead-based soldering material meticulously formulated for high-precision electronic repairs. This 30g solder paste is designed to melt at 183°C, making it ideal for tasks requiring a strong, reliable bond, such as PCB mainboard soldering and BGA welding processes.
Features
- Optimized Alloy Ratio: Composed of Sn63/Pb37, providing a perfect balance between workability and strength.
- Medium Temperature Melting Point: Melts uniformly at 183°C, suitable for sensitive electronic components.
- High Viscosity: Ranges from 160-230Pa.s, ensuring the paste stays in place before soldering.
- Fine Granule Size: With a granule size of 20-38um, it allows for precise application without clogging.
- No-Clean Formula: Leaves minimal residue, reducing the need for post-soldering cleanup.
Technical Parameters
- Brand: Relife
- Model: RL-401
- Alloy Ratio: Sn63/Pb37
- Viscosity: 160-230Pa.s
- Granule Size: 20-38um
- Melting Point: 183°C
- Net Weight: 30g
Specification
- Tool typeBatteries
- CategorySoldering Tools
- Netto weight (kg)0.000
- Ean2200000516510
Going green
We are constantly improving our carbon footprint to protect our planet. Read more on how we are adapting our processes to lower our footprint.